Frances Hugle

Frances B. Hugle
Born Frances Betty Sarnat
August 13, 1927
Chicago, Illinois
Died May 24, 1968(1968-05-24) (aged 40)
Nationality American
Alma mater University of Chicago; University of Cincinnati
Occupation Scientist, engineer, inventor
Known for Microscopic and integrated circuitry pioneer; inventor of Tape automated bonding
Spouse(s) William Bell Hugle
Parent(s) Nathan Sarnat, Lylian Steinfeld

Frances Sarnat Hugle (August 13, 1927 – May 24, 1968) was an American scientist, engineer, and inventor who contributed to the understanding of semiconductors, integrated circuitry, and the unique electrical principles of microscopic materials.[1] She also invented techniques, processes, and equipment for practical (high volume) fabrication of microscopic circuitry, integrated circuits, and microprocessors which are still in use today.[2]

In 1962, Hugle co-founded Siliconix, one of Silicon Valley's first semiconductor houses. She is the only woman included in the "Semiconductor Family Tree."[3]

Early life and education

Frances Betty Sarnat (Sarnatzky) was born on August 13, 1927 in Chicago, Illinois, to Nathan Sarnat (Sarnatzky) and Lylian Steinfeld. Sarnat attended Hyde Park High School on Chicago's south side, where she participated in many of the school's science clubs, including the chemistry, physics and biology clubs. In the spring of 1944, just before her graduation, she was selected to represent Hyde Park High in Chicago's Math Contest, in which she took first place.[4]

After graduation, Sarnat attended the University of Chicago. In 1946, at the age of eighteen, she was awarded a Bachelor of Philosophy.[5] It was while studying here that she married fellow student, William B. Hugle, in 1947.[5][6] They founded several R&D companies together.

In 1957, the University of Chicago additionally awarded her a Bachelor of Science degree in chemistry based upon the course work she had completed between 1944 and 1947.[5]

Hugle's graduate studies in crystallography, including studies in x-ray diffraction techniques, took place at the Polytechnic Institute of Brooklyn, Brooklyn, NY.

In 1960, she received a Master of Science degree from the University of Cincinnati.[7]

Hugle also received an honorary doctorate from a Canadian university. In the mid-1960s, she taught at Santa Clara University.

Professional career

Hugle founded her first research company, Hyco Labs, in the mid-1940s and assumed the title of Director of Research. At Hyco Labs, she began the research and development of materials, processes and specialized equipment that would become the foundation of much of her future work. After marrying, the Hugles founded Stuart Laboratories, Inc.[6][8] She worked at Stuart Laboratories from October 1949 until February 1951. They have four children, Margaret, Cheryl, David and Linda.

In March 1951, she went to work for Standard Electronics Research Corp., where she was cleared for "secret" work. She remained at Standard Electronics Research Corp until August 1952, and shortly thereafter obtained employment at the Baldwin Piano Company, which was looking to use transistors in their electronic organs and may have been interested in "military and industrial electronics".[6][9][10] In 1959, both Hugle and her husband began work at Westinghouse Company in Pittsburgh.[9] In 1960, at the request of Westinghouse, the Hugles moved to southern California to set up an astro-electronics laboratory.[11]

In late 1961, the Hugles moved again, to the Laurelwood Subdivision in Santa Clara, in the San Francisco Bay Area, where the Hugles co-founded Siliconix in 1962.[8][12] She developed Siliconix's first products and became its first Director of Research and Chief Engineer.[13][14]

After leaving Siliconix in 1964, Hugle developed products for two more semiconductor companies that she co-founded with her husband. These were Stewart Warner Microcircuits, where she once again served as Director of Research and as Chief Engineer,[8][9] and Hugle Industries.

Inventions and patents

Hugle was awarded at least seventeen patents, some posthumously.[15] Amongst these, she has been credited with the invention of tape automated bonding (TAB) (a technology first put into commercial use by General Electric); and Hugle was the first person to patent flex-based packaging.[16][17][18][19] She has also been identified as a pioneer in early flip chip technology.[8] Patents include:

References

  1. ↑ US patent 3465213, Frances B. Hugle et al, "Self-Compensating Structure for Limiting Base Drive Current in Transistors", issued 1969-09-02
  2. ↑ Gilleo, Ken. "Chapter 5: The Printed Circuit as a Chip Carrier" (PDF). PC Fab. Retrieved 30 May 2012.
  3. ↑ Hoefler, Don C. (July 8, 1968). "Semiconductor Family Tree" (PDF). Electronic News. Retrieved 3 April 2013.
  4. ↑ "3 Hyde Park Seniors Find Higher Math a 'Pushover'". Southtown Economist. May 7, 1944. Retrieved Oct 11, 2012.
  5. 1 2 3 About Alumni - Alumni Deaths; University of Chicago Magazine, Volume 96, Number 3; February 2004.
  6. 1 2 3 "William Bell Hugle - inventor"; Hendricks, Tyche; SF Gate; October 17, 2003 obituary article; retrieved 11/04/2012.
  7. ↑ Sarnat Hugle, Frances. "Cathodic Deplating of Rhodium". World Cat. Retrieved 25 May 2012.
  8. 1 2 3 4 Levine, Bernard; Guinther, Fred; February 24, 1997; The Package, "Electronic News;" 43:2156; p. 36.
  9. 1 2 3 Rostky, George; October 30, 1997; A Radio and Silicon, "Electronic Engineering Times;" Issue 978; pp. 113–120.
  10. ↑ Hoffler, Don C.; January 18, 1971; Silicon Valley U.S.A., Part II; "Electronic News."
  11. ↑ Strickler, Carolyn (Week of Oct. 8 1961). "Pictorial Living". Los Angeles Examiner. Check date values in: |date= (help);
  12. ↑ Vishay. "Vishay 50-Year Timeline". Vishay. Retrieved 30 May 2012.
  13. ↑ Carey, Pete; October 16, 2003; Silicon Valley Pioneer, Siliconix Founder, Dies at 76, "Mercury News;" p 1C.
  14. ↑ US 3328214, Hugle, Frances, "Process for Manufacturing Horizontal Transistor Structure", published April 22, 1963, issued June 27, 1967
  15. ↑ "Google Patent Search, Name = Frances Hugle". Retrieved 15 October 2012.
  16. ↑ Vardaman, E. Jan. "The Flexibility of Flex Circuits". Friday, 29 October 2010 17:17. Printed Circuit Design and Fab. Retrieved 23 May 2012.
  17. ↑ US 3465150, Hugle, Frances, "Method of Aligning Semiconductors", published Jun 15, 1967, issued Sep 2, 1969
  18. ↑ Tummala, Rao (2001). Fundamentals of Microsystems Packaging. McGraw-Hill. pp. 44;363. doi:10.1036/0071418075. ISBN 0071371699.
  19. ↑ Gilleo, Ken; August 2005; Flex, Chips and RFID: Synergy in Minneapolis; "CircuiTree;" 18:8; pp 48, 50.
  20. ↑ Hugle, Frances. "Isolation Techniques for Integrated Circuits". Filed October 10, 1966. National Museum of American History. Retrieved May 23, 2012.
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