IEEE Transactions on Advanced Packaging

IEEE Transactions on Advanced Packaging  
Former names
IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing
Abbreviated title (ISO 4)
IEEE Trans. Adv. Packag.
Discipline Multi-chip modules, wafer-scale integration
Language English
Edited by Ganesh Subbarayan
Publication details
Publisher
Publication history
1999–2010
Frequency Quarterly
1.276
Indexing
ISSN 1521-3323
LCCN 99111625
CODEN ITAPFZ
OCLC no. 39742480
Links

IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276.[1]

References

  1. "IEEE Transactions on Advanced Packaging". 2010 Journal Citation Reports. Web of Science (Science ed.). Thomson Reuters. 2011.

External links

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