Open Interconnect Consortium

The Open Interconnect Consortium (OIC) is an industry group whose stated mission is to develop standards and certification for devices involved in the Internet of Things (IoT) based around CoAP.[1] OIC was created in July 2014 by Intel, Broadcom, and Samsung Electronics.[2] Broadcom left the consortium shortly after it was established, due to a disagreement on how to handle intellectual property.[3] Currently, there are more than 80 member companies including Cisco Systems, General Electric, Intel, MediaTek and Samsung.[4]

The OIC tries to realize the Internet of Things also called Network of Everything. The IoT requires easy discovery, and trusted and reliable connectivity between things. The OIC delivers a framework that enables these requirements via a specification, a reference implementation and a certification program. IoTivity the open source reference implementation of the OIC specifications is actively developed by different members of the OIC.

In September 2015 a release candidate of the specification in version 1.0 for the core framework, smart home device, resource type, security and remote access capabilities was released to the public, accessible also for non members without registration.[5]

On February 19, 2016 the OIC changed its name to the Open Connectivity Foundation and added Microsoft, Qualcomm and Electrolux to its membership.[6]

See also

References

  1. ↑ Wolf, Michael. "Smart Home Show: The Open Interconnect Consortium". http://www.technology.fm/. technology.fm. Retrieved 6 March 2015. External link in |website= (help)
  2. ↑ Intel, Samsung create Internet of Things group
  3. ↑ It’s an IoT standards shakeup as Broadcom dumps Intel’s Open Interconnect Consortium
  4. ↑ List of OIC members
  5. ↑ Candidate Specification 1.0 released
  6. ↑ Microsoft, Qualcomm Join Rebranded Internet of Things Club

External links

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