Wedge bonding

Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry. Wire bonders typically require threading a 25 µm diameter wire through an minuscule hole.

Wafer bonding techniques used in ICs, MEMS, and NEMS

Substrate bonding	Direct bonding Plasma-activated bonding Anodic bonding Eutectic bonding Glass frit bonding Adhesive bonding Thermocompression bonding Transient liquid phase diffusion bonding

Connections	Compliant bonding Wire bonding Ball bonding Thermosonic bonding Tape-automated bonding (TAB)

See also	Bond characterization

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