Broadway (microprocessor)

Broadway

IBM Broadway microprocessor from the inside of a Wii. The reference to Canada in the picture is related to where it was packaged i.e. by IBM Canada in Bromont.
Produced	From 2006 to Present
Designed by	IBM and Nintendo
Common manufacturer(s)	IBM
Max. CPU clock rate	729 MHz
Min. feature size	90 nm (2006-2007), 65 nm (2007-present)
Instruction set	Power Architecture (PowerPC ISA 1.10)
Microarchitecture	PowerPC G3
Cores	1
L1 cache	32/32 kB
L2 cache	256 kB
Predecessor	Gekko
Successor	Espresso
Application	Nintendo Wii
Variant	PowerPC 750CL

Broadway is the codename of the 32-bit Central Processing Unit (CPU) used in Nintendo's Wii video game console. It was designed by IBM, and is currently being produced using a 65 nm SOI process.

According to IBM, the processor consumes 20% less power than its predecessor, the 180 nm Gekko used in the Nintendo GameCube video game console.^[1]

Broadway is being produced by IBM at their 300 mm semiconductor development and manufacturing facility in East Fishkill, New York. The bond, assembly, and test operation for the Broadway module is performed at the IBM facility in Bromont, Quebec. Very few official details have been released to the public by Nintendo or IBM. Unofficial reports claim it is derived from the 486 MHz Gekko architecture used in the GameCube and runs 50% faster at 729 MHz.^[2]

The PowerPC 750CL, released in 2006, is a stock CPU offered by IBM and virtually identical to Broadway. The only difference is that the 750CL comes in variants, ranging from 400 MHz up to 1000 MHz.^[3][4][5]

Specifications

• 90 nanometer process technology, shrunk to 65 nm in 2007. ^[6]
• Superscalar Out-of-order execution Power Architecture core, specially modified for the Wii platform
• IBM silicon on insulator (SOI) technology
• Backward compatible with the Gekko processor
• 729 MHz
• 4 stages long Two integer ALUs(IU1 and IU2) - 32 bit
• 7 stages long 64-bit floating-point unit(FPU) (or 2 × 32-bit SIMD, often found under the denomination "paired singles")
• Branch Prediction Unit(BPU)
• Load-Store Unit(LSU)
• System Register Unit(SRU)
• Memory Management Unit (MMU)
• Branch Target Instruction Cache(BTIC)
• SIMD Instructions - PowerPC750 + Roughly 50 new SIMD instructions, geared toward 3D graphics
• 64 kB L1 cache (32 kB instruction + 32 kB data)
• 256 kB L2 cache
• 2.9 GFLOPS

External bus

• 64-bit
• 243 MHz
• 1.944 gigabytes per second bandwidth

Gallery

Broadway 39X6735, 2006 90 nm, 21×21 mm package  Broadway A 43E4048, 2006-2007 90 nm, 21×21 mm package  Broadway B 43E5070, 2007-2008 65 nm, 21×21 mm package  Broadway-1 48J2662, 2008-present 65 nm, 15×15 mm package

These images are illustrations and only approximately to scale.

References

1. IBM (2006). "IBM Ships First Microchips for Nintendo's Wii Video Game System". Retrieved 2006-09-08.
2. Wii Technical Specification, Wii
3. IBM Broadway RISC Microprocessor User’s Manual, v0.6 (page 361)
4. IBM PowerPC 750CL Microprocessor Revision Level DD2.x
5. IBM PowerPC 750CL RISC Microprocessor User’s Manual
6. http://www.neogaf.com/forum/showpost.php?p=47873023&postcount=205